Data Envelopment Analysis
Data-oriented Analytics - Productivity - Benchmarking - Efficiency - Performance - Composite Index



We started the DEAIC - Data Envelopment Analysis International Conference in the summer of 2016. The main objective of DEAIC is to position DEA as a data-oriented data science tool for productivity analytics, benchmarking, performance evaluation, and developing composite indexes, among other new uses, in addition to the traditional uses such as, production efficiency and productivity measurement.

We seek new DEA developments that are tailored for big data research and data analytics.


DEA is a Data Science tool. We know DEA stands for Data Envelopment Analysis. As OR/MS is moving into the area of Operations Analytics, our DEA is evolving into Data Envelopment Analytics. For example, a number of DEA special issues have featured DEA and Data Analytics.


While our research still bears the wonderful name of DEA, researcher and scholars around the global have already recognized its new power in the era of big data research. Our conferences (DEAIC) intend to lead the efforts to showcase and push the research frontier of new DEA.


Conference Committees


Joe Zhu

Nanjing Audit University, China
Worcester Polytechnic Institute, USA

Advisory Committee

Yao Chen

Nanjing Audit University, China
University of Massachusetts Lowell, USA

Wade D. Cook

York University, Canada

Tsu-Tan Fu

Soochow University, Taiwan

Shiuh-Nan Hwang

Ming Chuan University, Taiwan

Chiang Kao

National Cheng Kung University, Taiwan

Hsuan-Shih Lee

National Taiwan Ocean University, Taiwan

Liang Liang

Hefei University of Technology, China

Sungmook Lim

Dongguk University, Korea

Wenbin Liu

Kent University, UK

Hiroshi Morita

Osaka University, Japan

Joseph C. Paradi

University of Toronto, Canada

Jesús T. Pastor

Universidad Miguel Hernández de Elche, Spain

Lawrence M. Seiford

University of Michigan, USA

H. David Sherman

Northeastern University, USA

Joe Zhu

Nanjing Audit University, China
Worcester Polytechnic Institute, USA

International Committee

Juan Aparicio

Universidad Miguel Hernández de Elche, Spain

Necmi Avkiran

University of Queensland, Australia

Vincent Charles

University of Buckingham, UK

Chialin Chen

National Taiwan University, Taiwan

Chien-Ming Chen

Nanyang Technological University, Singapore

Juan Du

Tongji University, China

Hirofumi Fukuyama

Fukuoka University, Japan

Don Galagedera

Monash University, Australia

Yeming Gong

University of Lyon, France

Greg N. Gregoriou

State University of New York at Plattsburgh, USA

Song Han

Song Han, Renmin University of China

Mei-Ying Huang

National Taipei University, Taiwan

Zhimin Huang

Adelphi University, USA

Dariush Khezrimotlagh

Penn State University, Harrisburg, USA

Chia-Yen Lee

National Cheng Kung University, Taiwan

Zhanxin Ma

Inner Monglia University, China

Victor Podinovski

Loughborough University, UK

Maria Conceição Portela

Universidade Católica Portuguesa, Portugal

Inguruwatt Premachandra

Otago University, New Zealand

Paul Rouse

Auckland University, New Zealand

Biresh K. Sahoo

Xavier University, India

Wanfang Shen

Shandong University of Finance and Economics, China

Mehdi Toloo

Technical University of Ostrava, Czech Republic

Fernando Vidal

Universidad Miguel Hernández de Elche, Spain

Huaqing Wu

Hefei University of Technology, China

Jie Wu

University of Science & Technology of China

Feng Yang

University of Science & Technology of China

Guoliang Yang

Institute of Policy and Management, Chinese Academy of Sciences, China

Yinsheng Yang

Jilin University, China

Zhongbao Zhou

Hunan University, China

Weiwei Zhu

Nanjing University of Posts and Telecommunications, China


Conference Photos

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